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MG s - 8329TFF-25ML 8329TFF Thermally Conductive Adhesive - Fast Cure Epoxy, 25 mL Dual Dispenser

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Product ID: 89469569

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mg chemicals

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About the item

Thermal conductivity of 0. 8 W/(m·K).
1:1 mix ratio.
Working life: 4 minutes, set time: 15 minutes.
Cure time: 3 hours at room temperature or 15 minutes at 65 °c (149 °f).
Flame retardant – UL 94V-0 registered.

8329Tff is a thermally conductive, fast-cure two-part epoxy adhesive. It is off-white, smooth, thixotropic, and bonds well to a wide variety of substances. It is also flame retardant, and meets the UL 94V-0 standard. For a 1 ml quantity, a minimal service cure can be achieved in 15 minutes at room temperature, and a full cure in 3 hours. This product is used to bond heat sinks, LEDs and other heat-generating components in electronic assemblies. It is suitable for use with dual-syringes, mix-tips and automatic dispensing systems. For a longer working life, use 8329TFM or 8329Tfs. Application instructions: for best results, follow the procedure below. For quantities less than 1 ml or for stricter stoichiometry control, mix by weight with a high-precision balance. Heat cure to achieve optimal conductivity. Syringe or cartridge: to insert the cartridge in the , see the application guide Section for dispensing accessories. 1. Twist and remove the cap from the cartridge or syringe. Do not did cap. 2. Dispense a small a to ensure even flow of both parts. 3. (Optional) attach a static mixer to the 8329tff-50ml. A. Dispense and did 3 to 5 ml of the product to ensure a geneous mixture. B. After use, dispose of static mixer. 4. Without a static mixer, dispense material on a mixing surface or container, and thoroughly mix parts a and b together. 5. To stop the flow, pull back on the plunger. 6. Clean nozzle to prevent contamination and material buildup. 7. Replace the cap on the cartridge or syringe. Cure instructions room temperature cure: let cure at room temperature for 3 H. Heat cure: put in oven at 65 °C [149 °F] for 15 min.

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