WIRE BONDING IN MICROELECTRONICS, 3/E 3rd Edition

The book is great! Both in quality of the book and on the content. It was a great help for me, especially on my field of work.

It took a lot longer then I expected to get shipped out but maybe they were out of stock and found one for me. If that is the case then that's awesome. I only paid $45 including shipping.

Wire Bonding in Microelectronics continues to be the definitive resource for wire bonding information.

I had the first edition of this book which was printed in about 1989. The new edition has been expanded to include many more details on newer technologies such as wire bonding on no traditional surfaces such as immersion gold, and nickel palladium gold.

It's a great book by one of the leading authorities in wirebonding. George Harman knows the material science, reliability, process, and so many other details involved in wirebonding.

This updated edition is a must have for anybody working in the wire bonding industry! Well done!

Good to read. It was helpfull for me.

Perfekt.Beim Lesen kommt Freude auf. Alles sehr verständlich erklärt.Tiefer Einblick in alle wichtigen Themen des Wire Bonding.Excellente Quellenarbeit und Verweise auf weiterführende Literatur.

ワイヤーボンディングという加工方法とボンディングされたものの品質、信頼性について、技術的な内容がコンパクトに良くまとまっています。前版より、困ったときに、辞書代わりに、お世話になっていますが、本当に役立つ本で、半導体ワイヤーボンディング工程の技術者、半導体製品の設計、品質保証部門の技術者は手元に置かれると良いと思います。

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