Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield

Name: Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield
Price: 1068056.00 PYG
Availability: InStock

Product ID: 193975759

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Fast shipping and excellent packaging. The Leatherman tool feels very premium and sturdy.

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Anjali K.

The product quality is outstanding. Exactly what I needed for my work.

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The product exactly matches the description. Very satisfied with my purchase.

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